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Power module
There are many types of electronic modules, common types of power modules, power modules, current or voltage regulator modules, IGBT modules, field effect modules, rectifier modules, IPM modules, PIM modules, thyristor modules, and frequency conversion modules.
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Application
| Product | Application example | product category | product type | curing condition | application |
|---|---|---|---|---|---|
| BeGEL 8708 | IGBT | Silicone | One-component | Room temperature curing | Chip potting protection |
| Besil 9446 | IGBT | Silicone | One- component | Heat curing | Bonding of heat dissipation plate and housing |
| BeSIL 9445 | IGBT | Silicone | One-component | Heat curing | Bonding of ceramic substrate and heat sink plate |
| Begel 8708 | Thyristor | Silicone | One-component | Room temperature curing | Chip potting protection |
| BeSIL 9446 | Thyristor | Silicone | One-component | Heat curing | Bonding of heat dissipation plate and housing |
| BeSIL 9445 | Thyristor | Silicone | One-component | Heat curing | Bonding of ceramic substrate and heat sink plate |
| BeEP 6225FR | Thyristor | Epoxy | Two-component | Heat curing | Terminal potting and fixing |
| BeGEL 8708 | Silicon controlled rectifier | Silicone | One-component | Room temperature curing | Chip potting protection |
| BeSIL 9446 | Silicon controlled rectifier | Silicone | One-component | Heat curing | Bonding of heat dissipation plate and housing |
| BESIL 9445 | Silicon controlled rectifier | Silicone | One component | Heat curing | Bonding of ceramic substrate and heat sink plate |
| BEEP 6225FR | Silicon controlled rectifier | Epoxy | Two-component | Heat curing | Terminal potting and fixing |
Selection Guide
Adhesive/Sealant Solutions for Semiconductor Selection Guide
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