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Power device

Beginor High-temperature thermosetting one-component epoxy adhesive meets the requirements for sealing of Transistor holes package. beginor silicone plays a key role in bonding the growth barrier line and the Chips bonding.

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Beginor

Application

ProductApplication
example 
product categoryproduct typecuring
condition
application
BeEP
6688
TransistorEpoxyOne-componentRoom temperature curingHole sealing 
BEEP
6688-15
TransistorEpoxyOne componentRoom temperature curingHole sealing
PM
1200
Tantalum capacitorSiliconeOne-componentRoom temperature curingPrimer
BeSIL 8778-2Tantalum capacitorSiliconeTwo-componentRoom temperature curingBarrier line
BeSIL 9446Automotive industrySiliconeTwo-componentRoom temperature curingChip adhesive

Selection Guide

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Adhesive/Sealant Solutions for Semiconductor Selection Guide

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