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Home > Solution > Semiconductor > Power device
Power device
Beginor High-temperature thermosetting one-component epoxy adhesive meets the requirements for sealing of Transistor holes package. beginor silicone plays a key role in bonding the growth barrier line and the Chips bonding.
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Application
| Product | Application example | product category | product type | curing condition | application |
|---|---|---|---|---|---|
| BeEP 6688 | Transistor | Epoxy | One-component | Room temperature curing | Hole sealing |
| BEEP 6688-15 | Transistor | Epoxy | One component | Room temperature curing | Hole sealing |
| PM 1200 | Tantalum capacitor | Silicone | One-component | Room temperature curing | Primer |
| BeSIL 8778-2 | Tantalum capacitor | Silicone | Two-component | Room temperature curing | Barrier line |
| BeSIL 9446 | Automotive industry | Silicone | Two-component | Room temperature curing | Chip adhesive |
Selection Guide
Adhesive/Sealant Solutions for Semiconductor Selection Guide
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