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BESIL GP 8818 Two Part Silicone-based Thermally Conductive gap filler
- Two-part 1 : 1
- Low interface stress
- Optimized dispensing
- Thermal conductivity 1.8 W/m.K
- Room temperature curing
- Easy to rework
FEATURES
BESIL® GP 8818 Thermal gap filler is a two part liquid silicone-based material, curing at room temperature once mixed. BESIL GP 8818 is a soft and compressible material designed to dissipate heat from electronic devices such as PCB modules by conducting it to a heat sink such as an aluminum housing.
| Composition | Silicones |
| Appearance | A : Yellow / B : White |
| Mix Ratio by Weight | A：B=1：1 |
| Specific Gravity | 2.7 g/cm3 |
| Viscosity @ 25℃ | 250,000 cPs |
| Thermal Conductivity | 1.8 W/m.K |
| Heat Capacity | 1.0 J/G.K |
| Hardness, shore 00 | 50 |
| Dielectric Strength |
400V/Mil |
| Volume Resistivity | 1010 Ohm-meter |
| Use Temperature range | -60℃ – 175℃ |
| RoHS Compliant | Yes |
Used for smartphones, portable computing devices, LED lighting modules, PCB modules, communication equipment and electric vehicle parts, provide a reliable cooling solution.
USE
| Mix ratio | Two part，A：B=1 : 1 （by weight/volume） |
| Pot life
Cure Condition |
60min @ 25℃
5 hours @ 25℃ or 2 minutes @ 100℃ |
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