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BESIL GP 8818 Two Part Silicone-based Thermally Conductive gap filler

  • Two-part 1 : 1
  • Low interface stress
  • Optimized dispensing
  • Thermal conductivity 1.8 W/m.K
  • Room temperature curing
  • Easy to rework

Features

FEATURES

BESIL® GP 8818 Thermal gap filler is a two  part liquid silicone-based material, curing at room temperature once mixed. BESIL GP 8818 is a soft and compressible material designed to dissipate heat from electronic  devices such as  PCB modules by conducting it to a heat sink such as an  aluminum housing.

Data Sheet

Composition Silicones
Appearance A : Yellow / B : White
Mix Ratio  by Weight A：B=1：1
Specific Gravity 2.7 g/cm3
Viscosity @ 25℃ 250,000 cPs
Thermal Conductivity 1.8 W/m.K
Heat Capacity 1.0 J/G.K
Hardness, shore 00 50
Dielectric Strength

400V/Mil
Volume Resistivity 1010  Ohm-meter
Use Temperature range -60℃ – 175℃
RoHS Compliant Yes

Application

Used for smartphones, portable computing devices, LED lighting modules,  PCB modules,  communication equipment and electric vehicle parts, provide a reliable cooling solution.

How to use

USE

Mix ratio Two part，A：B=1 : 1  （by weight/volume）
Pot life

 

Cure Condition

 60min @ 25℃

5 hours @ 25℃  or

2 minutes @ 100℃

TDS Download

[auth-download url=”https://beginor-chemical.com/wp-content/uploads/2019/03/TDS-of-BESIL-GP-8818-LIQUID-THERMAL-GAP-FILLER.pdf” title=”TDS Download BESIL GP 8818″]

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