BESIL TCMP 8815 8825 8835 Thermal Conductivity Gap Filler
- 1:1 mixing(thixotropic)
- Low stressapplication
- Easy tooperate
- Heating accelerationreaction
- Low hardness andmicro-stick
- Platinum catalyzed and the siloxane volatiles are extremelylow
- ROHS, halogen free, REACH certified
FEATURES
BESIL TCMP Liquid Thermal Conductivity Gap Filler is 1.5-3.5 W/mK ， thixotropic low stress applications,designed to provide enhanced thermal management for advanced automotive batteries, automotive electronics, and communications equipment.Compared with traditional materials, it provides enhanced reliability and rework ability.
| Data Sheet: | ||||
| TCMP（8815） | TCMP（8825） | TCMP（8835） | UNIT | |
| Color Part A | Yellow | Pink | Blue | |
| Color Part B | White | White | White | |
| Features | Soft gel | Soft gel | Soft gel | – |
| Density | 2.75 | 2.95 | 3.2 | g/cm3 |
| Pre-curing performance | ||||
| A:B | 100: 100 | 100:100 | 100: 100 | – |
| Mixed viscosity (20rpm) | 200,000 | 200,000 | 300,000 | cps |
| Shelf life@ 25℃ | 6 month | 6 month | 6 month | |
| Post-curing performance | ||||
| Color | Yellow | Pink | Blue | – |
| Tack Free Time | 15mins/25℃ | 15mins/25℃ | 15mins/25℃ | |
| Curing condition
Curing condition |
30 mins /25℃
5 mins /80℃ |
30 mins /25℃
5 mins /80℃ |
30 mins /25℃
5 mins /80℃ |
|
| Curing condition | 2 mins /100℃ | 2 mins /100℃ | 2 mins /100℃ | |
| Hardness | Shore 00 = 60 | Shore 00 = 70 | Shore 00 = 60 | |
| Asker C = 25 | Asker C = 40 | Asker C = 30 | ||
| Tensile strength | 0.3 | 0.3 | 0.3 | Mpa |
| Elongation | 200 | 150 | 200 | % |
| Operating temperature | -60~200 | -60~200 | -60~200 | ℃ |
| Electrical performance | ||||
| Breakdown voltage | 18 | 18 | 18 | KV/mm |
| Volume resistance | 1*1014 | 1*1014 | 1*1014 | Ohm-cm |
| Dielectric constant | 5.5 | 5.8 | 5.8 | (1KHz) |
| Flammability rating | V-0 | V-0 | V-0 | UL 3mm |
| Thermal performance | ||||
| Thermal Conductivity | 1.5 | 2.5 | 3.5 | W/m*K |
| Specific heat capacity | 1 | 1 | 1 | J/g-K |
| Maximum particle size | 70 | 90 | 90 | μm |
- Lithiumbattery
- vehicleelectronics
- Communicationfacility
- Computer and peripheralproducts
- Application between heat source and heatsink
Use:
— 50ml or 400ml Dual Cartridge
- Install the Dual Cartridge into the applicator and remove the end cap from the front of the Dual
- After installing the Dual Cartridge, squeeze the mix from the nozzle until the A and B components are evenly mixed.
- The mixed glue is applied to the substrate and mated with the
- During the working time of the gap filler, clamp the positioning to achieve the treatment strength or gap thickness
–Dispensing equipment
- If you need Dispensing equipment, please consult the sales department or the nearestsalesperson
TDS Download TCMP Gap filler