Besil 8230-3 silicone potting material – Shanghai Beginor Chemical Technology Co., Ltd.

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Besil 8230-3 two part low stress silicone gel encapsulant

Soft, low durometer
Low viscosity
Room temperature or accelerated heat cure
Good thermal conductivity
Mix ratio 1 to 1
Low internal stress during thermal cycling
Highly flowable for filling small gaps and fast processing
Good heat dissipation
Prevents water ingress
Electrically insulative
Low total cost of ownership

Features

Beginor chemical Besil 8230 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.

Data Sheet

Property	Unit	Result
Color
Part A		Black
Part B		Off-White
Mixed		Dark Grey to Black
Viscosity1 (Part A)	cP	3500±500
Viscosity2 (Part B )	cP	3500±500
Mixed Viscosity3	cP	3500±500
Specific Gravity4 (Part A)		1.62±0.05
Specific Gravity5 (Part B)		1.62±0.05
Thermal Conductivity11	W/mK	0.75

Application

Power Conversion Devices (Inverters, Converters, Driver)
Junction Boxes
Automotive Electronics Modules

How to use

MIXING AND DE- AIRING

These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.

TDS Download

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