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Home > Product > Potting Material >Silicone Material > BeSil 8230-1
Besil 8230-1 A/B 1:1 Soft Low Stress thermal conductivity Silicone Gel
- Soft, low durometer
- Low viscosity
- Room temperature or accelerated heat cure
- Good thermal conductivity
- Mix ratio 1 to 1
- Low internal stress during thermal cycling
- Highly flowable for filling small gaps and fast processing
- Good heat dissipation
- Prevents water ingress
- Electrically insulative
- Low total cost of ownership
Beginor chemical Besil 8230 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.
| Property | Unit | Result |
| Color | ||
| Part A | Black | |
| Part B | Off-White | |
| Mixed | Dark Grey to Black | |
| Viscosity1 (Part A) | cps | 4500 |
| Viscosity2 (Part B ) | cps | 4500 |
| Mixed Viscosity3 | cps | 4500 |
| Specific Gravity4 (Part A) | 1.50 | |
| Specific Gravity5 (Part B) | 1.50 | |
| Working Time at 25°C (Pot Life) | minutes | 15±5 |
| Thermal Conductivity11 | W/mK | 0.60 |
Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments such as:
- Power Conversion Devices (Inverters, Converters, Driver)
- Junction Boxes
- Automotive Electronics Modules
DESCRIPTION
Beginor polymers brand silicone encapsulants are supplied as two- part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications.
Beginor polymers silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement.
Beginor polymers silicone encapsulants require no post cure and can be placed in service immediately following the completion of the cure schedule.
Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.
MIXING AND DE- AIRING
These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.
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