Bepu 7586 polyurethane adhesive

It is used for pouring and potting of communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.

• Preliminary drying: please dry PCB and substrates which need to potting in 50°C condition,then put it in application place.
• Mixture: mixing A and B according to mass ratio, to reducemix air, should vertically stir as same direction about 2-3 minutes. The edge and bottom of container also should be stir well, otherwise, it will appear partial non solidified phenomenon. The entire operation process, A and B, mixer, stir tool etc. all should avoid getting to water and moisture. If working place has air-container, it will be better to keep constant temperature and humidity (T&H: 23°C,50%)
• Defoaming: For demanding of smooth potting surface without bubbles, the mixed material should be defoamed under the vacuum pressure ≤-0.1mpa. It’s better to defoame by stirring along with vacuum together. (Suggest to use automatic mixing equipment, it not only can be mixed in proper precise proportion, and will not mix in air bubbles)
• Potting: Pouring the mixed sealant into the devices,for complex structure or big size devices, should be poured by times. Can use a hot air gun to eliminate the surface floating bubbles.
• Both A and B part should be sealed well, if it cannot be used up one time, please cover up bung again, sealed storage. Especially the part B, please try to reduce the time of contact with the air every time operating process.

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