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Home > Product > Potting Material > PU Material > BEPU 6608
BEPU 6608 high thermal conductivity polyurethane potting compond
- Low viscosity, good operability
- Excellent low temperature characteristics, excellent weather resistance
- Excellent electrical insulation and stability
- Good waterproof, moistureproof, water absorption is very low
- It has good adhesion to most metals and plastics
FEATURES
BEPU 6608 A/B is A two-component solvent-free, room temperature or heat curing resin elastomer compound, used for two-component sealing and filling. Raw material contains no heavy metals, green environmental protection, wide process operation, high physical properties of finished products, and good adhesion to the base material. It can be solidified at room temperature and by heating. It can be solidified in deep layer. The two components have good fluidity after mixing and excellent flexibility after solidifying.
Conventional performance
| Test item | Units and Conditions | Testing standard | 6608 A/B | |
| Appearance | A | Visual | Visual | Black/White viscous fluid |
| B | Visual | Tan liquid | ||
| Viscosity | A | 25℃ mPa·s | GB/T 10247-2008 | 4000±2,000 |
| B | GB/T 10247-2008 | 30±10 | ||
| A+B | GB/T 10247-2008 | 1000±200 | ||
| Density | A | 25℃ g/cm3 | GB/T 15223-1994 | 1.58±0.05 |
| B | GB/T 15223-1994 | 1.23±0.05 | ||
| A+B | GB/T 15223-1994 | 1.54±0.05 | ||
| Operating time | 25℃ min
(up to 10000cps) |
GB/T 10247-2008 | 30~50 | |
| Gel time | 25℃ hrs | GB/T 10247-2008 | 4~6 | |
| Initial curing time | 25℃ hrs | GB/T 10247-2008 | 10~20 | |
| Mix ratio | Weight ratio | —- | A ：B=100 ：16 | |
| Curing conditions | ℃/h | —- | 25℃/ 24 h or 70℃/2h | |
Characteristics after curing
| Item | Units and Conditions | Testing standard | BEPU 6608 |
| Color | Visual | Visual | Black/White |
| Hardness | Shore A | GB/T 531-2008 | 85±5 |
| Water absorption | 24hrs, 25℃，% | GB 8810-2005 | <0.2 |
| Tensile strength | MPa | GB/T 528-2009 | 10.0 |
| Elongation | % | GB/T 528-2009 | 20 |
| Shear strength | MPa, Al-Al | GB/T 6328-86 | 2.3 |
| Thermal conductivity | W/m.K | GB/T10297-1998 | 0.82 |
| Glass transition temperature Tg | ℃ | GBT 11998-1989 | -5 |
| Volume resistivity | 25℃，Ω·cm | GB/T 1692-92 | 5*1014 |
| Dielectric strength | 25℃，kV/mm | GB/T 1695-2005 | 26 |
| Dielectric constant | 50Hz，25℃ | GB/T 1693-2007 | 6.0 |
| Dielectric loss | 50Hz，25℃ | GB/T 1693-2007 | 0.12 |
| Linear shrinkage | v | GBT 4207-2012 | ≥600 |
| Thermal conductivity | % | HGT 2625-1994 | 1.0 |
| Glass transition temperature Tg | μm/（m，℃） | GBT 20673-2006 | 120 |
| Flame retardant grade | UL | UL94 | V-0 |
| Temperature | ℃ | GBT 20028-2005 | -50～150 |
* Note: The above performance data are typical test data of the product at humidity 70% and temperature 25℃. It is only for customers’ reference and cannot guarantee all the data that can be achieved in a specific environment. Please use the measured data shall prevail.
It is used in communication equipment, transformers, control power supplies, and ignition controllers. And pouring of electronic sensors, etc.
USE
- Material taking: This product A material contains functional filling powder, there will be clear liquid on the upper layer of the glue, before use, need to mix the original packaging glue evenly, and then use the material. After taking material, seal the original package in time to prevent excessive contact with moisture. After the rubber material is exposed to air for a long time, it may lead to bubbling phenomenon after AB material is mixed. If conditions are available, raw material A can be placed in A thermal insulation environment above 30℃.
- Operational matters: B material exposed to the atmosphere will absorb water and hydrolyze, the phenomenon is cloudy until agglomerate, A material also need to avoid moisture storage, so as not to generate too many bubbles in curing. The environment during solidification should be controlled as low as possible, and the relative humidity should not exceed 60%.
- Preheating: please bake at 70~80℃ for 1~2 hours. Also can reduce the temperature, prolong the heating time, to remove device moisture. Bepu 6608 at low temperature, the viscosity will become high, can preheat the material to 25℃~45℃, easy to use.
- Defoaming: vacuum A\B barrel separately and stir at the same time to ensure that A\B glue is vacuum without bubbles before mixing.
- Pouring: the mixture is poured into the device through a static mixer with a gel time of approximately 60mins.
- Curing: 25℃/120 mins, complete curing takes 24 hours. Environmental humidity should be controlled in <70%, low temperature should be appropriate to extend the curing time.
Contact: business@beginor-chemical.com
Color: black/yellow
Color: black
Color: yellow
Color: light yellow