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BEPU 6606 black polyurethane potting material

  • Low viscosity, strong operability
  • Excellent low temperature characteristics,excellent weather resistance
  • Excellent electrical insulation and stability
  • Good water and moisture resistance,extremely low water absorption
  • Good adhesion to most metals and plastics

FEATURES

BEPU 6606 A/B is a two-component solvent-free roomtemperature or heat-curable resin elastomer composition used for two-component sealing, potting.

Performance

 

Test items Units and conditions Test standards A / B
Appearance A Visual Visual Black viscous fluid
B Visual Brown liquid
 

Viscosity

A  

25℃ mPa·s

GB/T 10247-2008 4,500±1,000
B GB/T 10247-2008 30±10
A+B GB/T 10247-2008 1000±200
 

Density

A  

25℃ g/cm3

GB/T 15223-1994 1.45±0.05
B GB/T 15223-1994 1.27±0.05
A+B GB/T 15223-1994 1.38±0.05
Pot time 25℃ min GB/T 10247-2008 8 mins (viscosity up to 2000cps)
Gel time 25℃ min GB/T 10247-2008 30 mins(viscosity up to 10000cps)
Initial curing time 25℃ min GB/T 10247-2008 3 hrs
Mix ratio Weight ratio —- A :B=85:15
Curing condition ℃/h —- 25℃/ 24 h or 70℃ 2hrs

Characteristics after curing

Item Unit or condition Test standard BEPU 6606
Color Visual Visual Black
Hardness Shore A GB/T 531-2008 80±5
Water absorption 24hrs, 25℃,% GB 8810-2005 <0.2
Tensile Strength MPa GB/T 528-2009 3.0
Elongation % GB/T 528-2009 70
Shear strength MPa, Fe-Fe GB/T 6328-86 5
Shear strength MPa, Al-Al GB/T 6328-86 6.5
Thermal Conductivity W/m.K GB/T10297-1998 0.52
Glass transition temperature Tg GBT 11998-1989  

-5

Volume resistivity 25℃,Ω·cm GB/T 1692-92 1.8*1015
Dielectric strength 25℃,kV/mm GB/T 1695-2005 18
Dielectric constant 50Hz,25℃ GB/T 1693-2007 2.54
Dielectric loss 50Hz,25℃ GB/T 1693-2007 0.005
Linear shrinkage % HGT 2625-1994 1.0
Linear thermal expansion μm/(m,℃) GBT 20673-2006 <Tg, 55

>Tg, 140

Application temperature GBT 20028-2005 -50~150

It is used in communication equipment, transformers, control power supplies, and ignition controllers. And pouring of electronic sensors, etc.

How to use:

  1. Before use, the original packaging glue must be stirred evenly, and then taken out for use. After taking the material, seal the original package in time to prevent excessive contact with moisture. After the material is exposed to air for a long time, it may cause bubbling after the AB material is mixed. Under certain conditions, the original packaging of material A can be placed in a thermal environment above 30
  2. Operation: When material B is exposed to the atmosphere, it will absorb water and hydrolyze, resulting in a crystalline state. Material A also needs to be stored away from moisture to avoid excessive air bubbles during curing. The environment of the curing process should be controlled as low as possible, and the relative humidity should not exceed 60%. When the crystalline  state appears, please heat the material at 40-60 ℃ until the material returns to the state before
  3. Preheating: Place the components at 70~80℃ and bake for 1~2 hours. You can also reduce the temperature and extend the heating time to remove the device moisture. Bepu 6606 will increase  the viscosity at low temperature, and the material can be preheated to 25℃~45℃, which is easy to use.
  4. Defoaming: Vacuum the A\B barrel separately and stir at the same time to ensure that the A\B    is vacuum and no bubbles before
  5. Casting: The mixture is poured into the device through a static mixer, the gel time is about 60mins.
  6. Curing: 25 ℃/120mins, full curing time is 24 hours. The ambient humidity should  be controlled at <70%. If the temperature is low, the curing time should be extended as

TDS Download Bepu 6606

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