Performance

Characteristics after curing

It is used in communication equipment, transformers, control power supplies, and ignition controllers. And pouring of electronic sensors, etc.

How to use:

1. Before use, the original packaging glue must be stirred evenly, and then taken out for use. After taking the material, seal the original package in time to prevent excessive contact with moisture. After the material is exposed to air for a long time, it may cause bubbling after the AB material is mixed. Under certain conditions, the original packaging of material A can be placed in a thermal environment above 30
2. Operation: When material B is exposed to the atmosphere, it will absorb water and hydrolyze, resulting in a crystalline state. Material A also needs to be stored away from moisture to avoid excessive air bubbles during curing. The environment of the curing process should be controlled as low as possible, and the relative humidity should not exceed 60%. When the crystalline  state appears, please heat the material at 40-60 ℃ until the material returns to the state before
3. Preheating: Place the components at 70~80℃ and bake for 1~2 hours. You can also reduce the temperature and extend the heating time to remove the device moisture. Bepu 6606 will increase  the viscosity at low temperature, and the material can be preheated to 25℃~45℃, which is easy to use.
4. Defoaming: Vacuum the A\B barrel separately and stir at the same time to ensure that the A\B    is vacuum and no bubbles before
5. Casting: The mixture is poured into the device through a static mixer, the gel time is about 60mins.
6. Curing: 25 ℃/120mins, full curing time is 24 hours. The ambient humidity should  be controlled at <70%. If the temperature is low, the curing time should be extended as

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