BEPU 6603 black polyurethane potting material – Shanghai Beginor Chemical Technology Co., Ltd.

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BePU 6603 55 shore A soft polyurethane potting material

Low viscosity, long operating time
Excellent mechanical properties, good toughness
Excellent low temperature characteristics, excellent weather resistance
Excellent electrical insulation and stability
Good waterproof, moisture-proof, extremely low water absorption
Good adhesion to most metals and plastics

Features

FEATURES

BEPU 6603A /B is a two-component solvent-free room temperature or heat-curable resin elastomer composition used for two-component sealing, potting, flame retardant, thermal conductivity and other fields.

Data Sheet

Performance

Test items		Units and conditions	Test standards	A / B
Appearance	A	Visual	Visual	Black/White viscous fluid
Appearance	B	Visual	Visual	Light Yellow liquid
Viscosity	A	25℃ mPa·s	GB/T 10247-2008	600±100
	B		GB/T 10247-2008	1000±500
	A+B		GB/T 10247-2008	800±400
Density	A	25℃ g/cm3	GB/T 15223-1994	1.0±0.05
Density	B	25℃ g/cm3	GB/T 15223-1994	1.15±0.05
Pot time		200g，25℃ min	GB/T 10247-2008	60~100（up to100000mPa·s）
Mix ratio		Weight ratio	—-	A ： B=1：1
Initial curing time		200g，℃/h	—-	25℃/24hr

Characteristics after curing

Item	Unit or condition	Test standard	BEPU 6603 black
Hardness	Shore-A	GB/T 531-2008	55±10
Volume resistivity	25℃，Ω·cm	GB/T 1692-92	1*10¹⁵
Water absorption	24hrs, 25℃，%	GB 8810-2005	<0.2
Dielectric strength	25℃，kV/mm	GB/T 1695-2005	22
Using temperature	℃	GBT 20028-2005	-50～120
Tensile Strength	Mpa	GB/T 528-2009	5
Elongation	%	GB/T 528-2009	180%
Shear strength	Mpa, Fe-Fe	GB/T 7124-2008	2.0
Thermal Conductivity	W/m.K	GB/T10297-1998	0.25
Dielectric constant	50Hz，25℃	GB/T 1693-2007	2.8
Linear shrinkage	%	HGT 2625-1994	1.2
Linear thermal expansion	μm/（m，℃）	GBT 20673-2006	200

Application

It is used in communication equipment, transformers, control power supplies, and ignition controllers. And pouring of electronic sensors, etc.

How to use

How to use

Preheating: Place the device at 70~80℃ and bake for 1~2 hours. The temperature can also be reduced and the heating time can be extended to remove moisture from the device. Bepu 6603 has a higher viscosity at low temperatures, and the material can be preheated to 25°C~45° It is easy to use.
Mixing: Stir evenly in the original package of A, and then weigh the A and B materials in proportion. When stirring, use the vertical stirring rod and stir in the same direction clockwise (or counterclockwise) for 2 to 3 minutes. Note that the bottom and edges of the container should also be stirred evenly, otherwise there will be partial non-solidification.
Defoaming: The potting surface is required to be smooth and free of bubbles, and the mixture should be vacuumed (≤-0.1mpa) to remove bubbles. The dynamic deaeration of vacuum while stirring is more conducive to the removal of bubbles. For those using mechanical metering, mixing and potting, steps 2 and 3 are omitted.
Pouring: Pouring the mixture into the device. If the device has a complex structure and large volume, it should be poured in stages. The pouring bubbles can be blown by a hot air gun. Can eliminate surface blisters.
Curing: 25℃/24h, or 80℃/2h can be cured. The ambient humidity should be controlled at <70%, and the curing time should be extended as appropriate when the temperature is low.
In the case of insufficient curing time or low room temperature, it is normal for the surface to become sticky the next day, and it will gradually disappear after a few days.
The curing of potting glue is affected by temperature and amount of glue. The higher the temperature, the shorter the curing time, and the higher the amount of glue, the faster the curing speed.