Begel 8710-2 two-component transparent self-healing silicone gel

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Begel 8710-2 two-component transparent self-healing silicone gel

1:1 addition type, good adhesive strength and self-healing
High elongation, excellent flexibility for mechanical stress relieving
Low oil penetration after cured, good anti-poisoningproperty
Good dielectric in high temperature for high voltage protection
Excellent aging resistance and weatherability
Excellent waterproof, corrosion prevention, moisture proof and chemical media resistance

Features

FEATURES

BeGel 8710(2#) A & B is a two component silicone elastomer that crosslinks at room temperature by polyaddition reaction.The pueolymerisation can be accelerated by heat ( max. 150℃ ).

Data Sheet

Components

	*Part A*	*Part B*
Appearance	Low viscous liquid	Low viscous liquid
Color	Clear	Clear or blue
Viscosity at 25℃	350-550 mPa.s	350-550 mPa.s
Density at 25℃	0.99 g/cm³	0.99 g/cm³

Mixed components

Mix ratio	A：B = 100：100 *by volume*
Viscosity after Mixing	350-550 mPa.s
Potting life	20-40 minutes at 25℃
Gel time	40-60 at 25℃
Cruing time	4 hours at 25℃ 20 minutes at 80℃

Potting life: the time of the viscosity becomes to double.

3 . Cured compound

Test at 25℃ after curing 7days at RT

Appearance	Clear or light blue
Penetration,1/mm, 9.38g, core	96 cured 4hrs
Penetration,1/mm, 9.38g, core	90 after 72hrs at 80℃
Dielectric Strength,KV/mm	25
Volume Resistivity,Ω·cm	1.0×10¹⁵
Dielectric Constant at 1 MHz	2.8
Range of Using temperature	– 60 ∽ 200 ℃

Application

Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.

How to use

USE

Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements.
Still the potted component to let out the bubbles. It can be cured by heat, about 15mins in 80°C. It needs about 1 hours to cure under room temperature.
- Vacuum defoaming can improve the performance of cured product.
- Seal the remaining products tightly after use.
- Low temperature will slow the curing speed; heat curing is recommended.
- It’s hard for Begr 8710 to cure if contact with sulfur, amine or Sn

TDS Download

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