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Home > Product > Jelly Gel > Silicone Gel > Begel 8606
Begel 8606 two-component transparent self-healing silicone potting gel
- 1:1 addition type, good adhesive strength and self-healing
- High elongation, excellent flexibility for mechanical stress relieving
- Low oil penetration after cured, good anti-poisoningproperty
- Good dielectric in high temperature for high voltage protection
- Excellent aging resistance and weatherability
- Excellent waterproof, corrosion prevention, moisture proof and chemical media resistance
FEATURES
BeGel 8606 It is a transparent two-component self-healing silicone gel, which becomes a special soft material with buffer and automatic recovery after curing. Used to isolate moisture and other harmful contaminants from contacting the circuit board, and provide an insulator for high voltage. Another use is to provide stress relief to protect circuits and interconnectors from high temperatures and mechanical stress.
| Part A | Part B | |
| Composition | Polysiloxane | Hydrogen-containing polysiloxanes |
| Appearance | Colorless liquid | Colorless liquid |
| Viscosity, 25 ℃ the CPS | 900 | 500 |
| Specific gravity, g/cm3 | 0.99 | 0.99 |
| Mixing ratio | A：B = 100：100 weight ratio | |
| Mixed viscosity | 750 cps | |
| After mixing operation time | 135 mins 25℃ | |
| Hardening conditions | At 25℃ 24hr
or At 80℃ 60mins |
|
| Appearance of hardening | Slightly cloudy or colorless transparent gel | |
| Degree of penetration,1/10 mm | 70 | |
| Thermal conductivity, W/m.K | 0.22 | |
| Dielectric strength (KV/mm) | 25 | |
| The volume resistance (Ω · cm) DC500V | 1.0×1015 | |
| Loss factor (1 MHz) | ＜0.001 | |
| Dielectric constant (1 MHz) | 2.8 | |
| Operating temperature range | – 60 ∽ 260 ℃ | |
| Long-term use temperature range | -50 ∽ 220 ℃ | |
Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Operation process
- Weigh A and B components in the ratio of 1:1, mix evenly, and directly inject into the components (or modules) to be potted and protected.
- The potted components can be left to stand and can be heated and cured (at 80 ℃, it takes about 30 minutes), or they can be cured directly at room temperature, which takes about 24 hours.
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