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Begel 8250 high purity two component liquid silicone material for optical device modules

  1. High transparency
  2. Excellent heat resistance
  3. Long-term resistancetoUV-A and UV-B
  4. No yellowing
  5. Fast curing and rapid demold
  6. Extremely accurate molding effect
  7. Lighter than glass

FEATURES

BeSil 8250 is high purity two-component heat curing silicone materials.

Resistance to environmental pollution, moisture, shock, vibration, etc., Maintain optical properties, mechanical properties and electrical properties in a wide range of temperature, humidity and harsh environmental conditions

Properties before curing

Property

Standard/Units BeSil 8250 A

BeSil 8250 B

Ingredient

—- Polysiloxane

Hydrogen polysiloxane

Appearance

Visual inspection Colorless liquid

Colorless liquid

Viscosity

mPa·s (25°C) 4000-6000

4000-6000

Density

g/cm3 (25°C) 0.99

0.99

Mixing ratio

Mass ratio

A:B=100:100

Properties after curing

Hardness

shore A

50

Tensile strength

MPa

5.5

Light Transmission

450nm@1mm,%

> 90

Volume resistance

ohm.cm

2×1015

Designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.

USE

  1. The substrate surface should be clean and dry. The substrate can be heated to remove surface moisture. Using naphtha, methyl ethyl ketoxime (MEK) or other suitable solvent to clean surface of the substrate. It should not use the solvent which dissolve or corrode to the substrate, should not use residual solvent.
  2. Please keep accurate weigh to a clean glass container and mix thoroughly. When using high speed mixing equipment, heat will generate and the work time will reduce.
  3. Under 10mmHg vacuum extrusion bubble. Usually prolapse bubbles before dispensing packaging material.
  4. In most cases, the polysiloxane is suitable for working long hours at -45°Cto 200°C, the maximum short-term resistant to 350°C, the specific use, it is best to test the actual requirements.
  5. Before the uncured material, containing not touch N \ P \ S and other organic matter, cannottouch Sn \ Pb \ Hg \ Bi \ As the ionic compound, etc., cannottouch the acetylene-containing \ active vinyl compound, peroxide cannot touch not touch the water gas and alcohols. These substances will hinder curing material reaches a certain concentration, the specific performance of three phenomena: the flow has been in a state completely cured, and the substrate base surface with thin fluid or in Las state, the contact surface and the substrate smiling bubbles. Fully test before use.
  6. Should be cured by heating using a hot air oven ventilation to prevent the accumulation of trace amounts of hydrogen generated in the curing process to produce an explosion hazard.

[auth-download url=”https://beginor-chemical.com/wp-content/uploads/2019/03/TDS-of-Besil-8250-silicone-optical-encapsulate.pdf” title=”TDS Download BeSil 8250″]

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