Beep 6688 epoxy adhesive

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Beep6688 epoxy adhesive cured by heat, designed for general structure adhesive applications

One component ,solvent free
Easy to handling
Low stress
No Halogen
low VOC, low odor
High shear and impact strength
High temperature resistance
Excellent outing aging
Excellent electrical insulation
Good moisture resistance
Exhibits relatively high flow

Features

BEEP6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.

The cured material can provide excellent shear strength, along with impact and heat resistance. It’s designed for protection of bare semiconductor devices.

Data Sheet

Items	Value	Method
Before cured
Appearance	Transpanent fluid	\
Viscosity,25℃，mPa.s	1100±300	GB/10247-2008
Specific gravity,25℃,g/cm³	1.10±0.05	GB/T 13354-92
Shelf life	3 mon@ -5℃
Curing conditions	30min@150℃	\
Hardness,Shore D	83±5	GB/T 531.1-2008
Coefficient of Thermal Conductivity, W/(m·K)	0.27	GB/T 20673-2006
Shear strength, Mpa, steel/steel	>12	GB 6328-86
Glass Transition Temperature (Tg) by TMA, °C	120	GB 11998-1989
Service temperature（℃）	-40～180	GBT 20028-2005

Application

BGA
IC memory cards
Chip carriers
Hybrid circuits
Chip-on-board
Multi-chip modules and Pin grid arrays
Automotive applications

How to use

Surface preparation：keep surfaces clean, dry and grease-free, use a suitable solvent(such as alcohol, acetone) for the degreasing.
Apply the adhesive to cleaned surfaces, assemble parts by sufficient pressure to spread the adhesive to all bonding area. Use a jig/clamp to fix parts till the adhesive is fully cured.
Cure the adhesive according to the schedule listed in the table. Do not move/shock parts during curing.
Before using up, keep the adhesive container tightly sealed.