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Beep 6663 low-viscosity high-performance one component epoxy structural adhesive
BEEP 6663w-1 is a low-viscosity, one-component, high-performance epoxy resin structural adhesive developed for miniaturization, lightweight and high output of power, electrical and electronic equipment.
FEATURES
It is characterized by good storage stability at room temperature, rapid curing under heating, high bonding strength, good toughness, and excellent temperature and weather resistance.
| Item | Test method or condition | Test Results | |
| BEEP 6663 | |||
| Before curing | Appearance | Visual | White paste |
| Viscosity | mPa·s, 25℃ | 12,000±2,000 | |
| density | g/cm3, 25℃ | 1.45±0.05 | |
| Shelf life | 0～5℃ | 6 month | |
| 20～25℃ | 3month | ||
| After curing | Hardness | Shore-D, 25℃ | 85 |
| Glass transition temperature Tg | DSC, ℃ | 115 | |
| Use temperature range | ℃ | –50-155 | |
| Shear strength | MPa, Steel-steel,25℃ | >20 | |
- Miniaturization
- Lightweight
- High output of power
- Electrical and electronic equipment
USE
- Products should be stored in a cool and cool place at low temperature
- Remove the glue from the freezer before each use to restore the glue to normal temperature. The unused glue must be stored in the freezer
- If the viscosity is suitable after the storage period, it can continue to be used
- This product is non-dangerous and can be transported under normal conditions
- Please consult our Marketing Department if you need glue coating equipment
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