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Beep 6225 2:1 thermal conductivity high-temperature resistance epoxy potting material

  • Excellent adhesion,anti-cracking
  • Low CTE linear expansioncoefficient
  • Having a high thermalconductivity
  • Excellent electrical insulation,stability
  • Long-term use at 150 ℃ -180℃
  • Very low water absorption, good waterproof, moistureresistance
  • Flame retardancy

BEEP 6225A / B is a two-component solvent less, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance.

Before cured Item Method Unit BEEP 6225 A BEEP 6225 B
Appearance Visual inspection Black Liquid Beige paste
Viscosity GB/T 10247-2008 25℃,mPa·s 50,000±10,000 5,000±500
Density GB/T 13354-92 25℃,g/cm3 2.20±0.05 2.30±0.05
Mix rate Mass ratio Ratio=A:B 3 :2

 

Mix viscosity

 

GB/T 10247-2008

25℃,Pa·s 15,000±2,000
60℃,Pa·s 2,000±2,000
Operation time GB/T 10247-2008 60℃,min 25
Gel time GB/T 10247-2008 100℃,min 60

 

Used for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection.

 

Operation process

  • Preparation: Put A \ B material original packaging barrels at 60 ℃ environment preservation 2 hours, after take out, compound viscosity is
  • Mixing:Withthe A component of the filler will contain the time to precipitate down, so before the use of A component in the original packaging after mixing evenly, and then A, B components by weight ratio of 3: 2 weighing with Ratio, even after mixing can be
  • Component B may occur during storage or agglomeration of crystal (a normal case), if required beforeuse crystalline placed in an oven at 80 ℃ to melt it, and then cooled to room temperature and after use, which does not affect its
  • Good potting device, if necessary, vacuum may continue to help increase the electrical properties of the
  • Curing conditions: 100 ℃ * 2h + 120 ℃ * 2h + 150 ℃ *

The temperature is below 150 ° C and the final curing temperature can be omitted.

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