Beep 6108 transparent epoxy potting material

Used for potting protection of modules and circuit boards with high power dissipation requirements for high-power electronic components

1. After stirring thoroughly in the original packaging (no need stirring without filler),Mix part A and part B by mass ratio(See the table above for mixing ratios), Stir well and then potting.See the table above for the available time after mixing.Over time, the glue viscosity will be high and it is no longer suitable for perfusion.Therefore, the amount of glue should not be too much each time, otherwise it will cause waste.
2. Curing: Curing conditions see above table. The curing speed is related to the temperature, the temperature is high and curing is fast, the winter temperature is low, the curing time is prolonged, and various glues can be heated and cured.Curing for 2 to 3 hours at 80° After the glue is hardened, it can be assembled. The test generally needs to be cured after 24 ~ 48 hours.

Operation process

• PartA will settle in the storage process, first mix Part A in the original package, and then add Part A and Part B components by a weight ratio of 5:1. Potting.
• component may crystallize or agglomerate (normal condition) during storage.If crystallized, need to be placed in an oven at 80°C to melt before use(the container should be open to avoid gas expansion and damage the container), and then used after being cooled to room temperature, this does not affect its performance.
• It is normal for different seasons to have different curing speeds due to temperature changes, and low curing temperatures in winter will be slower. All the above glues can be heated and cured.