Beep 6102 epoxy potting material

Beep 6102 5:1 general type epoxy potting compound

Normal temperature can be cured, the curing process is low temperature,

low shrinkage rate.

Solid surface light, not cracking, moisture proof, insulation

Features

This product is non-dangerous goods and is transported and saved according to general chemicals.
shelf life is 12 months under 25 ℃. Please take a sample test before storage.
Black and white adhesive, in the stored procedure will have settlement, is normal phenomenon, can be inverted on a regular basis, can reduce settlement.

Data Sheet

Item	6102
Mixing ratio, weight ratio	5：1
Initial time, hr,25℃	4～6
Full cure time,hr, 25℃	24

Hardness,Shore-D		>80
Volume resistivity,Ω.cm,25℃		1.0×10¹⁴
Breakdown voltage,kV/mm,25℃		>18
Dielectric constant,1.2MHz,25℃		3.1±0.1
Dielectric loss tangent,1.2MHz		<0.01
Curing shrinkage,%		<2
Thermal conductivity，W/K.T		0.35
Shear strength,Fe-Fe,MPa		>7
Operating temperature range,℃		-40～120
Flame retardant rating UL 94		–

Application

Used for general electronic components filling and sealing of circuit boards.

Normal temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation

How to use

After stirring thoroughly in the original packaging (no need stirring without filler),Mix part A and part B by mass ratio(See the table above for mixing ratios), Stir well and then potting.See the table above for the available time after mixing.Over time, the glue viscosity will be high and it is no longer suitable for perfusion.Therefore, the amount of glue should not be too much each time, otherwise it will cause waste.
Curing: Curing conditions see above table. The curing speed is related to the temperature, the temperature is high and curing is fast, the winter temperature is low, the curing time is prolonged, and various glues can be heated and cured.Curing for 2 to 3 hours at 80° After the glue is hardened, it can be assembled. The test generally needs to be cured after 24 ~ 48 hours.

Operation process

PartA will settle in the storage process, first mix Part A in the original package, and then add Part A and Part B components by a weight ratio of 5:1. Potting.
component may crystallize or agglomerate (normal condition) during storage.If crystallized, need to be placed in an oven at 80°C to melt before use(the container should be open to avoid gas expansion and damage the container), and then used after being cooled to room temperature, this does not affect its performance.
It is normal for different seasons to have different curing speeds due to temperature changes, and low curing temperatures in winter will be slower. All the above glues can be heated and cured.

TDS Download

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