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Home > Product > Potting Material > Epoxy Material > Beep 6903
Beep 6903 two part thermal conductivity epoxy potting adhesive
- Good adhesion and anti-crack property
- Good toughness and high hardness
- Good waterproof, moisture resistance, very low water absorption
- Excellent electrical insulating properties, stability
- Very low expansion coefficient
- Very high glass transition temperature, can be used in 260°Cfor a long time
Beep 6903 is two-part solvent free heat curing epoxy potting compound. Room temperature curing will take a long time. Specially designed for the special requirements of long-term high temperature up to 260°C.
|
Item |
Unit | BEEP 6903A |
BEEP 6903B |
|
Composition |
— | White/black paste |
Transparent liquid |
|
Color |
25℃，mPa·s | 150,000±30,000 |
100±10 |
|
Viscosity |
25℃，g/cm3 | 1.71±0.05 |
1.16±0.05 |
|
Mixing ratio |
Ratio=A:B |
5:1 |
|
|
Operating time |
25℃，hr |
10 |
|
|
Gel time |
25℃，hr |
16 |
|
|
Curing time |
hr |
1hr/120℃+1hr/150℃ |
|
|
Thermal Conductivity |
W/m.k |
0.65 |
|
|
Glass transition temperature |
℃ |
190 |
|
|
Thermal Conductivity |
DC500V,Ω· cm |
2.00E +15 |
|
Encapsulating for electronics which need high temperature resistant requirements, such as sensors, high temperature wire harness, automotive electronics etc.
USE
- Stir part A in origin container in advance, then mix partA and part B by weight ratio 5:1 evenly, vacuum to remove bubbles, casting and filling during the operation period.
- It’sa normal phenomenon of crystallization or agglomeration during the storage of part B, should thaw it by putting it into an 80°C (To avoid gas expansion and destroy container, the container should be opened.) And then cooled to room temperature to use, this does not affect its performance.
- If necessary, continue to vacuum defoaming for components which been potted, help to increase the electrical performance of the device.
- Curing condition: heat curing in temperature 1hr/120℃+1hr/150℃.
- Inquiry Sepna trade department for dispenser equipment if needed.
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