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Beep 6663 low-viscosity high-performance one component epoxy structural adhesive

BEEP 6663w-1 is a low-viscosity, one-component, high-performance epoxy resin structural adhesive developed for miniaturization, lightweight and high output of power, electrical and electronic equipment.

FEATURES

It is characterized by good storage stability at room temperature, rapid curing under heating, high bonding strength, good toughness, and excellent temperature and weather resistance.

Item Test method or condition Test Results
BEEP 6663
Before curing Appearance Visual White paste
Viscosity mPa·s, 25℃ 12,000±2,000
density g/cm3, 25℃ 1.45±0.05
Shelf life 0~5℃ 6 month
20~25℃ 3month
After  curing Hardness Shore-D, 25℃ 85
Glass transition temperature Tg DSC, ℃ 115
Use temperature range –50-155
Shear strength MPa, Steel-steel,25℃ >20
  1. Miniaturization
  2. Lightweight
  3. High output of power
  4. Electrical and electronic equipment

USE

  • Products should be stored in a cool and cool place at low temperature
  • Remove the glue from the freezer before each use to restore the glue to normal temperature. The unused glue must be stored in the freezer
  • If the viscosity is suitable after the storage period, it can continue to be used
  • This product is non-dangerous and can be transported under normal conditions
  • Please consult our Marketing Department if you need glue coating equipment

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