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BePu 6606 two-component no solvent RTV/Heating curing Polyurethane Potting Sealant

Low viscosity, strong operability
Excellent low temperature characteristics,excellent weather resistance
Excellent electrical insulation and stability
Good water and moisture resistance,extremely low water absorption
Good adhesion to most metals and plastics

Features

FEATURES

BEPU 6606 A/B is a two-component solvent-free roomtemperature or heat-curable resin elastomer composition used for two-component sealing, potting.

Data Sheet

Performance

Test items		Units and conditions	Test standards	A / B
Appearance	A	Visual	Visual	Black viscous fluid
Appearance	B	Visual	Visual	Brown liquid
Viscosity	A	25℃ mPa·s	GB/T 10247-2008	4,500±1,000
	B		GB/T 10247-2008	30±10
	A+B		GB/T 10247-2008	1000±200
Density	A	25℃ g/cm3	GB/T 15223-1994	1.45±0.05
	B		GB/T 15223-1994	1.27±0.05
	A+B		GB/T 15223-1994	1.38±0.05
Pot time		25℃ min	GB/T 10247-2008	8 mins (viscosity up to 2000cps)
Gel time		25℃ min	GB/T 10247-2008	30 mins(viscosity up to 10000cps)
Initial curing time		25℃ min	GB/T 10247-2008	3 hrs
Mix ratio		Weight ratio	—-	A ：B=100:20
Curing condition		℃/h	—-	25℃/ 24 h or 70℃ 2hrs

Characteristics after curing

Item	Unit or condition	Test standard	BEPU 6606
Color	Visual	Visual	Black
Hardness	Shore A	GB/T 531-2008	80±5
Water absorption	24hrs, 25℃，%	GB 8810-2005	<0.2
Tensile Strength	MPa	GB/T 528-2009	3.0
Elongation	%	GB/T 528-2009	70
Shear strength	MPa, Fe-Fe	GB/T 6328-86	5
Shear strength	MPa, Al-Al	GB/T 6328-86	6.5
Thermal Conductivity	W/m.K	GB/T10297-1998	0.52
Glass transition temperature Tg	℃	GBT 11998-1989	-5
Volume resistivity	25℃，Ω·cm	GB/T 1692-92	1.8*1015
Dielectric strength	25℃，kV/mm	GB/T 1695-2005	18
Dielectric constant	50Hz，25℃	GB/T 1693-2007	2.54
Dielectric loss	50Hz，25℃	GB/T 1693-2007	0.005
Linear shrinkage	%	HGT 2625-1994	1.0
Linear thermal expansion	μm/（m，℃）	GBT 20673-2006	<Tg, 55 >Tg, 140
Application temperature	℃	GBT 20028-2005	-50～150

Application

It is used in communication equipment, transformers, control power supplies, and ignition controllers. And pouring of electronic sensors, etc.

How to use

How to use:

Before use, the original packaging glue must be stirred evenly, and then taken out for use. After taking the material, seal the original package in time to prevent excessive contact with moisture. After the material is exposed to air for a long time, it may cause bubbling after the AB material is mixed. Under certain conditions, the original packaging of material A can be placed in a thermal environment above 30
Operation: When material B is exposed to the atmosphere, it will absorb water and hydrolyze, resulting in a crystalline state. Material A also needs to be stored away from moisture to avoid excessive air bubbles during curing. The environment of the curing process should be controlled as low as possible, and the relative humidity should not exceed 60%. When the crystalline state appears, please heat the material at 40-60 ℃ until the material returns to the state before
Preheating: Place the components at 70~80℃ and bake for 1~2 hours. You can also reduce the temperature and extend the heating time to remove the device moisture. Bepu 6606 will increase the viscosity at low temperature, and the material can be preheated to 25℃~45℃, which is easy to use.
Defoaming: Vacuum the A\B barrel separately and stir at the same time to ensure that the A\B is vacuum and no bubbles before
Casting: The mixture is poured into the device through a static mixer, the gel time is about 60mins.
Curing: 25 ℃/120mins, full curing time is 24 hours. The ambient humidity should be controlled at <70%. If the temperature is low, the curing time should be extended as