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Home > Product > Thermal Conductivity > Potting Material > BeSil 8230-3
Besil 8230-3 two part low stress silicone gel encapsulant
- Soft, low durometer
- Low viscosity
- Room temperature or accelerated heat cure
- Good thermal conductivity
- Mix ratio 1 to 1
- Low internal stress during thermal cycling
- Highly flowable for filling small gaps and fast processing
- Good heat dissipation
- Prevents water ingress
- Electrically insulative
- Low total cost of ownership
Beginor chemical Besil 8230 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.
| Property | Unit | Result |
| Color | ||
| Part A | Black | |
| Part B | Off-White | |
| Mixed | Dark Grey to Black | |
| Viscosity1 (Part A) | cP | 3500±500 |
| Viscosity2 (Part B ) | cP | 3500±500 |
| Mixed Viscosity3 | cP | 3500±500 |
| Specific Gravity4 (Part A) | 1.62±0.05 | |
| Specific Gravity5 (Part B) | 1.62±0.05 | |
| Thermal Conductivity11 | W/mK | 0.75 |
- Power Conversion Devices (Inverters, Converters, Driver)
- Junction Boxes
- Automotive Electronics Modules
MIXING AND DE- AIRING
These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.
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