Besil 8250 silicone potting material

Designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.

USE

1. The substrate surface should be clean and dry. The substrate can be heated to remove surface moisture. Using naphtha, methyl ethyl ketoxime (MEK) or other suitable solvent to clean surface of the substrate. It should not use the solvent which dissolve or corrode to the substrate, should not use residual solvent.
2. Please keep accurate weigh to a clean glass container and mix thoroughly. When using high speed mixing equipment, heat will generate and the work time will reduce.
3. Under 10mmHg vacuum extrusion bubble. Usually prolapse bubbles before dispensing packaging material.
4. In most cases, the polysiloxane is suitable for working long hours at -45°Cto 200°C, the maximum short-term resistant to 350°C, the specific use, it is best to test the actual requirements.
5. Before the uncured material, containing not touch N \ P \ S and other organic matter, cannottouch Sn \ Pb \ Hg \ Bi \ As the ionic compound, etc., cannottouch the acetylene-containing \ active vinyl compound, peroxide cannot touch not touch the water gas and alcohols. These substances will hinder curing material reaches a certain concentration, the specific performance of three phenomena: the flow has been in a state completely cured, and the substrate base surface with thin fluid or in Las state, the contact surface and the substrate smiling bubbles. Fully test before use.
6. Should be cured by heating using a hot air oven ventilation to prevent the accumulation of trace amounts of hydrogen generated in the curing process to produce an explosion hazard.

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