BePu 6030 Transparent light yellow polyurethane potting glue

Conventional performance

Characteristics after curing

• This product is commonly used in electronic capacitors, automotive electronic module pooping;
• Household appliances such as lampblack stove, microwave oven, rice cooker, washing machine, air conditioning control PCB board glue seal;
• Moisture-proof and water-proof potting protection for the circuit board and magnetic coil of intelligent toilet, induction toilet, metal induction garbage can.
  three

Use process

• Removal of moisture: Put the components and circuit boards to be potted in an environment of 50 ℃ to remove moisture, and then flow to the area to be potted after drying.
• Mixing: Weigh the A and B ingredients in proportion. When stirring, use a vertical stir bar and stir in the same direction clockwise (or counterclockwise) for 2~3 minutes to minimize the air being stirred. Pay attention to the bottom and edges of the container to stir evenly, otherwise There will be partial non-curing. During the whole operation, avoid contact with water and moisture for component A, component B, mixing container, stirring tool, etc. The working environment is best adjusted by air conditioning, constant temperature and humidity (temperature 23℃, humidity 50%).
• Defoaming: For those who require smooth and no bubbles on the potting surface, vacuum (≤-0.1mpa) should be used to remove bubbles after mixing. The dynamic deaeration of vacuum while stirring is more conducive to the removal of air bubbles. For those who use mechanical metering, mixing and potting, steps 1 and 2 are omitted. (It is recommended to use automatic mixing equipment, which can not only accurately mix in the correct proportion, but also does not introduce air to produce bubbles.)
• Pouring: Pouring the mixture into the device. If the device has a complex structure and large volume, it should be poured in stages. The pouring bubbles can be blown with a hot air gun or the like. Can eliminate surface blisters.
• The components A and B must be sealed and stored. If they are not used up at one time, re-cover the lid and store in a sealed container. Especially for component B, please minimize the contact with air during each use.
• Mix component A and component B uniformly in a short time. The mixed glue can only be used within a limited time (operable time), otherwise it will not be used.
• The curing time is related to the amount and temperature of each mixing. When the amount is large or the temperature is high, the curing time will be relatively shortened. On the contrary, the curing time will be longer.
• The glue before curing is easier to clean. After curing, please use methylene chloride to clean, soak, soften and peel off the glue.
• Curing: 25℃/24h or 80℃/1h can be cured. The ambient humidity should be controlled at <50%, and the curing time should be extended as appropriate when the temperature is low.
• If you use equipment to fill glue, you only need to vacuum the AB material in the tank, pour into the object to be potted after metering and mixing, and then solidify or dry it in a tunnel oven.