Product |
Application
example |
product category |
product type |
curing
condition |
application |
BeGEL 8708 |
IGBT |
Silicone |
One-component |
Room temperature curing |
Chip potting protection |
Besil 9446 |
IGBT |
Silicone |
One- component |
Heat curing |
Bonding of heat dissipation plate and housing |
BeSIL 9445 |
IGBT |
Silicone |
One-component |
Heat curing |
Bonding of ceramic substrate and heat sink plate |
Begel 8708 |
Thyristor |
Silicone |
One-component |
Room temperature curing |
Chip potting protection |
BeSIL 9446 |
Thyristor |
Silicone |
One-component |
Heat curing |
Bonding of heat dissipation plate and housing |
BeSIL 9445 |
Thyristor |
Silicone |
One-component |
Heat curing |
Bonding of ceramic substrate and heat sink plate |
BeEP 6225FR |
Thyristor |
Epoxy |
Two-component |
Heat curing |
Terminal potting and fixing |
BeGEL 8708 |
Silicon controlled rectifier |
Silicone |
One-component |
Room temperature curing |
Chip potting protection |
BeSIL 9446 |
Silicon controlled rectifier |
Silicone |
One-component |
Heat curing |
Bonding of heat dissipation plate and housing |
BESIL 9445 |
Silicon controlled rectifier |
Silicone |
One component |
Heat curing |
Bonding of ceramic substrate and heat sink plate |
BEEP 6225FR |
Silicon controlled rectifier |
Epoxy |
Two-component |
Heat curing |
Terminal potting and fixing |