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Semiconductor

Adhesives are widely used in semiconductors, it will depend on the function requirements. The main categories include chip potting protection for power modules, bonding of heat sinks to the housing, bonding of ceramic substrates to heat sinks, and sealing of power components.

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Beginor

We are committed to do the research, development and application of adhesives for many years, multi-technology fundamentals to produce adhesives product line and services to customers, in order to meet the different needs of different categories and special applications.

Application

Power module

There are many types of electronic modules, common types of power modules, power modules, current or voltage regulator modules, IGBT modules, field effect modules, rectifier modules, IPM modules, PIM modules, thyristor modules, and frequency conversion modules.

Power device

Beginor High-temperature thermosetting one-component epoxy adhesive meets the requirements for sealing of Transistor holes package. beginor silicone plays a key role in bonding the growth barrier line and the Chips bonding.

Selection Guide

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Adhesive/Sealant Solutions for Semiconductor Selection Guide

We are committed to do the research, development and application of adhesives for many years, multi-technology fundamentals to produce adhesives product line and services to customers, in order to meet the different needs of different categories and special applications.