Beep 6618 epoxy adhesive

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Beep 6618 low temperature cured epoxy adhesive with high adhesion and low water absorption

BEEP®6618 is a low temperature cured one-component epoxy adhesive with high adhesion and low water absorption.

It can be used for bonding of various materials and has good storage stability.

Features

Packing

30ml/pcs

Storage conditions

Store in a clean, dry place at -20°C.

Shelf life:6 month

Data Sheet

Item	Test standard	6118 A	6118 B
Properties before cured:
Appearance		white or black paste	white or black paste
Base composition		epoxy resin	epoxy resin
Viscosity(mPa.s)	(GB/T 2794-1995)	15000	13000-17000
	(GB/T 13354-1992)	1.50	1.45-1.55
Properties after cured(sample cured at 80 ℃ 60 minutes)
Hardness(shore D) 80	(GB/T 2411-1980)	80
Shear strength(MPa)	(GB/T 7124-1986	(TSS-Fe)15, (TSS-Al ) 10
Elongation at break(%)	(GB 1040-1992)	2.3
Glass transition temperature(℃)	(ASTM E1545)	45
Thermal expansion coefficient	(GB/T 1036-1989)	α1 (PPM/℃) 45, α2 (PPM/℃)130
Water absorption(%)(24h@25℃)	(GB/T 1034-1998)	0.15
Dielectric strength(KV/mm)	(GB 1408.1-1999)	≥20
Surface resistance(Ω)	(GB/T 1410-2006)	1×10¹⁵

Application

Mainly used for bonding LED backlight module lens, and bonding camera module CCD / CMOS frame, suitable for bonding temperature-sensitive components.

How to use

Before use, it must be warmed at room temperature for more than 4 hours. Do not open the package until it is restored to room temperature.
It is recommended that the dispensing pressure be 0.15-0.25 MPa. Use needles 21 or 22 with a dispensing speed of 4-10 mm/s.
Applicable for 7 days at 25°C.
The unused glue is first put into a plastic bag and then stored in -20°C.

TDS Download

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