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Beep 6113 thermal conductivity epoxy potting material
- Heat curing will bring high heatresistance
- Excellent adhesion, anti-cracking
- Low CTE linear expansioncoefficient
- Having a high thermalconductivity
- Excellent electrical insulation,stability
- Long-term use at 150 ℃ -180℃
- Very low water absorption, good waterproof, moistureresistance
Beep 6113 thermal conductivity epoxy potting material, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance.
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Before cured |
Item | Method | Unit | BEEP 6113 A |
BEEP 6113 B |
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Appearance |
Visual inspection | — | Black Liquid |
Beige paste |
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Viscosity |
GB/T 10247-2008 | 25℃，mPa·s | 20,000±3,000 |
25 |
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Density |
GB/T 13354-92 | 25℃，g/cm3 | 2.35±0.05 |
0.93±0.05 |
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Mix rate |
Mass ratio | Ratio=A:B |
100 ：8 |
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Mix viscosity |
GB/T 10247-2008 | 25℃，mPa·s |
2,000±300 |
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Operation time |
GB/T 10247-2008 | 25℃，min |
45 |
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Gel time |
GB/T 10247-2008 | 60℃，min |
60 |
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After cured |
Hardness | GB/T 531.1-2008 | Shore D |
90 |
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Thermal conductivity |
GB/T 10297-1998 | W/mK |
1.0 |
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linear thermal expansion coefficient |
GB/T 20673-2006 | μm/（m，℃） |
20 |
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glass transition temperature |
DSC | ℃ |
95 |
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Shear strength |
GB 6328-86 | Mpa，Fe-Fe |
≥8 |
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Shear strength |
GB 6328-86 | Mpa，Al-Al |
≥8 |
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Dielectric strength |
GB/T 1693-2007 | kV/mm（25℃） |
≥18 |
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Loss factor |
GB/T 1693-2007 | （1MHz）(25℃) |
0.09 |
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Dielectric constant |
GB/T 1693-2007 | （1MHz）(25℃) |
2.9 |
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Volume resistance |
GB/T 1692-92 | DC500V,Ω· cm |
1.00E +15 |
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Applying temperature |
GBT 20028-2005 | ℃ |
-50–180 |
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Uesd for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection
Operation process
- Preparation: Put A material original packaging barrels at 40 ℃ environment preservation 2 hours, after take out, compound viscosity is thinning,
- Or use directly at normal room
- Mixing：Withthe A component of the filler will contain the time to precipitate down, so use a stirrer to make the filler and resin liquid mixed evenly. Then weighing A / B components with Ratio 100:8, mixing thoroughly for several minutes. After, the finished liquid will be ready for
- ComponentB may occur during storage or agglomeration of crystal (a normal case), if required before use crystalline placed in an oven at 60 ℃ to melt it, and then cooled to room temperature and after use, which does not affect its
- The exposed component B will be hydrolyzed in moisture and the color of hydrolysate will show the color of white as friable
- Good potting device, if necessary, vacuum may continue to help increase the electrical properties of the
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